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The following page content corresponds to the products formerly marketed by NEC Electronics
Complying with the latest-generation JEDEC standard for system memory, the µPD720900 Advanced Memory Buffer (AMB) works with SDRAM to implement high-capacity, high-throughput memory subsystems for applications such as servers and workstations. The µPD720900's SDRAM interface connects directly to DDR2-533, DDR2-667 and DDR2-800 devices. To support the JEDEC-standard, fully buffered DIMM (FB-DIMM), daisy-chained bus architecture, the µPD720900 provides FB-DIMM interfaces that enable 3.2-, 4.0- or 4.8-Gbps channel bit rates.
With these high-speed channels, the full-featured µPD720900 connects in a daisy chain with multiple AMB-based DIMMs and a host memory controller. As many as eight AMB devices can work seamlessly on each FB-DIMM channel, thus allowing use of very large memory capacities. The AMB smart interface accepts memory requests for its local DDR-2 SDRAM or forwards memory requests to other AMB-based DIMMs.
The µPD720900 AMB supports server, workstation, router and graphics controller applications with an industry-standard architecture that will become the mainstream server/workstation memory solution. These FB-DIMM memory subsystems offer reduced cost, greatly improved memory capacity and better signal integrity than existing stub-bus architectures. Designed to deliver on FB-DIMM's capabilities for extremely high reliability, the NEC Electronics µPD720900 AMB meets demanding application requirements for high-RAS (reliability/ availability/serviceability) systems.
Figure 1. µPD720900 Advanced Memory Buffer (AMB)
